• TDK sensors, paired with Microchip’s dsPIC33A DSC and LAN8651/LAN8679, bring real-time edge intelligence with single-pair Ethernet connectivity to robotics 
• The partner solution, showcased at electronica, supports robotics developers’ needs for higher sensor density and edge intelligence while reducing the complexity of individual connections

November 10, 2026

TDK Corporation (TSE:6762) and Microchip Technology Inc. (NASDAQ: MCHP) are demonstrating a distributed sensor-node platform for next-generation robotic systems at electronica, Munich, this week (TDK booth B5.520). The new platform combines sensing technology from InvenSense, a TDK group company, with Microchip’s dsPIC33A Digital Signal Controller (DSC) and LAN8651/LAN8679 based 10BASE-T1S single-pair Ethernet connectivity for real-time intelligence and edge AI processing for robotics applications.

Today’s humanoid robots may incorporate 100 or more sensors, as robots increasingly rely on sensors for smart perception, motor control, force and torque measurement, joint monitoring, safety and environmental awareness. The new Microchip + TDK platform is designed to help robotics developers integrate a greater number of intelligent sensor nodes throughout a robot, while also simplifying cabling and communications and increasing sensor-enabled perception. By processing sensor data locally at the edge on the dsPIC33A DSC, the solution can reduce latency, network traffic, and the computational workload of the robot’s central controller. 

“We’re partnering with Microchip to help solve a real need for our customers, which is how to easily integrate a multitude of sensors along with the dedicated, distributed processing capabilities that enable fast local intelligence,” said Massimo Mascotto, director of product marketing for InvenSense, a TDK group company. “With use of the Microchip + TDK sensor platform, robotics engineers can achieve more efficient motor control and smoother, more human-like robotic movements.”

The new platform’s demonstration board combines a Microchip dsPIC33A DSC, LAN8651/LAN8679 10BASE-T1S connectivity, a TDK InvenSense ICM-42688-P 6-axis inertial measurement unit (IMU), and a MikroE expansion connector for compatible additional TDK sensors. The Microchip dsPIC33A DSC can process and fuse the InvenSense IMU data locally before transmitting relevant information over the 10BASE-T1S network. Further, the MikroE expansion connector enables developers to evaluate compatible additional TDK sensors and configurations, such as the recently launched InvenSense PositionSense 9-axis solution for absolute orientation detection.

Microchip dsPIC33A DSC key features 

The Microchip dsPIC33A DSC combines a 200 MHz 32-bit core, DSP acceleration, and a double-precision floating-point unit with high-speed ADCs and high-resolution PWM capabilities. These features support demanding real-time sensing and control applications, including: 

• Sensor fusion 
• Digital filtering 
• Vibration analysis 
• Force and torque processing 
• Motion and joint monitoring 
• Condition monitoring 
• Real-time control loops 
• Edge AI and machine learning 

For robotics applications, the dsPIC33A DSC runs machine-learning algorithms for real-time gesture recognition using data from multiple sensors. This illustrates how distributed T1S-connected sensor nodes can support intelligent sensing and edge AI applications. The dsPIC33A DSC processes sensor data locally, allowing each node to perform acquisition, signal conditioning, filtering, sensor fusion, diagnostics and machine-learning functions before transmitting relevant information to the central controller. 

TDK IMU key features  

The InvenSense SmartMotion® ICM-42688-P is a 6-axis IMU combining a 3-axis accelerometer and a 3-axis gyroscope. Integrated with the Microchip dsPIC33A DSC, the IMU can support robotic applications such as: 

• Robot orientation and proprioception 
• Joint-motion monitoring 
• Motion stabilization 
• Vibration monitoring 
• Gesture recognition 
• Distributed condition monitoring 
• Positioning and articulation 
• Autonomy and safety 

Additional TDK sensing solutions for smart perception in robotics will be demonstrated at electronica, Munich, November 10–13, TDK booth B5.520; these include TMR and Hall sensors for ultra-precise angle detection; MEMS microphones for acoustic activity detection; temperature sensors for environmental monitoring; pressure sensors for tactile sensing; and 9-axis IMU+TMR sensing for exact location and orientation detection.  

The building blocks for the developed board combining the Microchip dsPIC33A DSC, InvenSense ICM-42688-P IMU, 10BASE-T1S connectivity, and a MikroE expansion connector are already available. Learn more about the new Microchip + TDK sensing platform via invensense.tdk.com/en-us/technology-partners. 

Glossary 

• 6-axis: 3-axis gyroscope + 3-axis accelerometer 
• IMU: inertial measurement unit  
• MEMS: micro-electro-mechanical systems  

Main benefits 

• Simplified and scalable sensor networking 
• Real-time edge intelligence 
• Faster system integration 
• A reusable platform for faster time to market 

Main Applications 

• Robotics, including motion sensing, orientation and joint monitoring, vibration analysis, gesture recognition, force and torque sensing and safety-related monitoring 

• Predictive maintenance including detection of vibration, shock, tilt and rotational behavior in motors, pumps, gearboxes, compressors and fans 

• Industrial automation and smart equipment including distributed monitoring of production machinery, conveyors, HVAC systems and energy equipment; and detection of misalignment, abnormal vibration, mechanical shocks and early signs of equipment failure

About TDK Corporation 

TDK Corporation (TSE:6762) is a global technology company and innovation leader in the electronics industry, based in Tokyo, Japan. With the tagline “In Everything, Better” TDK aims to realize a better future across all aspects of life, industry, and society. For over 90 years, TDK has shaped the world from within; from the pioneering ferrite cores to cassette tapes that defined an era, to powering the digital age with advanced components, sensors, and batteries, leading the way towards a more sustainable future. United by TDK Venture Spirit, a start-up mentality built on visions, courage and mutual trust, TDK’s passionate team members around the globe pursue better—for ourselves, customers, partners, and the world. Today, the state-of-the-art technologies of TDK are in everything, from industrial applications, energy systems, electric vehicles, to smartphones and gaming, at the core of modern life. TDK’s comprehensive, innovative-driven portfolio includes cutting-edge passive components, sensors and sensor systems, power supplies, lithium-ion and solid-state batteries, magnetic heads, AI and enterprise software solutions, and more—featuring numerous market-leading products. These are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics, TDK-Lambda, TDK SensEI, and ATL.  Positioning the AI ecosystem as a key strategic area, TDK leverages its global network across the automotive, information and communication technology, and industrial equipment sectors to expand its business in a wide range of fields. In fiscal 2026, TDK posted total sales of USD 16.6 billion and employed about 107,000 people worldwide. 

About InvenSense 

InvenSense, a TDK group company, is a world-leading provider of custom sensing solutions for consumer electronics, industrial, and automotive applications. InvenSense solutions integrate MEMS and magnetic sensors, such as IMUs, accelerometers, gyroscopes, compasses, microphones, and TMR sensors, with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors for maximized performance and accuracy. InvenSense solutions empower leading technology in smartphones, wearables, hearables, smart home, gaming, IoT, robotics, drones, industrial, automotive, and other applications. Headquartered in San Jose, California, and with offices worldwide, InvenSense became part of the Sensor Systems Business Company of TDK Corporation in 2017.